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مجموعة هانز لتكنولوجيا صناعة الليزر المحدودة ، حقوق الطبع والنشر © جوانجدونج ICP رقم 05013795

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HDZ-WAF600

الخصائص
1. With the green laser or UV laser, the focusing spot is fine, and it is non-contact marking.
2. Fully-automatic loading and unloading, automatic edge searching, simple operation and high efficiency.
3. The whole system adopts computer control, Windows operation platform,interface in English, self-developed software, easy to operate.
4. With high automation, it has the function of automatic fault alarm.
5. Precise marking to the product DIE.
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Product description

Application:

Applicable for the 6-inch, 8-inch and 12-inch wafer marking

 

Specification:

Machine model

HDZ-WAF500

HDZ-WAF600

Laser type

Fiber laser, CO2  (optional)

UV, green light (optional)

Laser power (customized according to the
customer’s actual marking need)

Fiber 20W 、CO2 10W

UV 7W, green light 10W

Cooling mode

Air cooling

Water cooling

Final processing repeated positioning precision

±0.2mm

±0.05mm

Processing product type

2 inch, 4 inch, 6 inch wafer

6 inch, 8 inch, 12 inch wafer

Power supply

220V, 50Hz

220V, 50Hz

Overall dimension (for reference)

900mm*1150mm*1700mm

1950mm*1650mm*1635mm

 

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暂未实现,敬请期待
暂未实现,敬请期待